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Tin Paste For Reballing SMD BGA IC CPU Mobile Phone Repair Solder Paste Scraping Knife Fixed Paste

Tin Paste For Reballing SMD BGA IC CPU Mobile Phone Repair Solder Paste Scraping Knife Fixed Paste

Regular price $11.70
Sale price Regular price $0.00
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Product Overview

This specialized tin paste is expertly formulated for intricate mobile phone and electronic component repair, including BGA, SMD, IC, and CPU reballing. It ensures a stable, reliable connection essential for restoring the functionality of critical mobile device parts, offering precision and performance for professional technicians.

Specifications
  • Brand Name: Not specified
  • Certification: CE
  • Origin: Mainland China
  • Chemical Composition: Contains organic solvent; high-concerned chemicals are listed as None.
Features
  • Designed for precise reballing of mobile phone IC, CPU, and BGA/SMD components.
  • Offers consistent viscosity at room temperature for accurate placement of electronic components.
  • Forms a permanent connection upon reaching soldering temperature through solvent evaporation.
  • Meets CE certification standards.
Measurements
  • Measurement Tolerance: ±1.0 cm, ±1.0 g (Please note: Specific product dimensions and weight in grams/ounces are not provided in the product information for detailed conversion.)
Packing List
  • Solder Tin Paste (quantity and specific tool inclusion like scraping knife not detailed in provided information)
Notes
  • Keep out of reach of children.
  • Avoid contact with eyes.
  • Use only in adequately ventilated areas.
  • Minimize skin contact and avoid prolonged exposure to vapor; wash skin thoroughly with alcohol and water if contact occurs.
  • Product packaging may be updated periodically without affecting product quality. New and old packaging will be shipped randomly.
Product Tags
  • Tin Paste
  • Mechanic Reballing
  • Solder Paste
  • SMD Solder
  • Tin Scraping Knife
  • Fixed Paste
  • Mobile Phone Repair
  • IC Repair
  • CPU Repair
  • BGA Repair
  • SMD Phone Repair
Product Type
  • Solder Paste
Disclaimer
  • Design Specifics: The visible gap is a deliberate functional feature of engineering and does not indicate a defect or damage.
  • Visual Variations: Actual product colors may vary slightly from online images due to differences in lighting conditions and monitor display settings.
  • Measurement Tolerance: Please allow for minor dimensional deviations resulting from manual measurement and manufacturing processes.
  • Policy Information: Consult our FAQ, Privacy Policy, and Terms & Conditions for comprehensive details regarding returns and exchanges.
Images

Solder Paste for Phone Repair

Solder Paste Application Example

Solder Paste Components and Flux

Solder Paste Consistency

Solder Paste for BGA Rework

Solder Paste for SMD Components

Reballing Solder Paste Detail

Solder Paste Application Method

High-Quality Solder Paste for Electronics

Mobile Phone Repair Solder Paste

Professional Solder Paste for ICs